| 摘要 |
A communication board is provided to be capable of easily communicating high-capacity information at high speed, between electronic instruments. Plural antennas(111-1~111-10) transmit and/or receive signals by electromagnetic induction, and are formed on a substrate(101) in coil pattern type. A semiconductor chip(112) has either a transmission circuit for transmitting the signals to the antennas(111-1~111-10) or a receiving circuit for receiving the signals from the antennas(111-1~111-10), and is mounted on the substrate(101). Input/output terminals(114) are connected to the semiconductor chip(112) through wiring layers(113) formed on the substrate(101), and are connected to electronic circuits of electronic instruments. |
