发明名称 Wafer edge inspection
摘要 In one embodiment, a surface analyzer system comprises a radiation targeting assembly to target a radiation beam onto a surface; and a reflected radiation collecting assembly that collects radiation reflected from the surface, wherein the reflected radiation collecting assembly comprises a mirror to collect radiation reflected from the surface.
申请公布号 US7161668(B2) 申请公布日期 2007.01.09
申请号 US20050196540 申请日期 2005.08.03
申请人 KLA-TENCOR TECHNOLOGIES CORPORATION 发明人 MEEKS STEVEN W.;KUDINAR RUSMIN;WHEELER WILLIAM R.;NGUYEN HUNG PHI
分类号 G01N21/88 主分类号 G01N21/88
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