发明名称 |
Plating machine and process for producing film carrier tapes for mounting electronic parts |
摘要 |
A plating machine for plating a film carrier tape for mounting electronic parts includes a plating tank for plating wiring patterns of a film carrier tape and also has a bubble adhesion prevention means that is position adjustable with respect to the surface of a plating solution contained in the plating tank. The process for producing film carrier tapes for mounting electronic parts comprises partially immersing a film carrier tape in a plating solution contained in a plating tank and selectively plating wiring patterns formed in the immersed area while adsorbing bubbles generated in the plating solution to a bubble adhesion prevention means arranged at the surface of the plating solution.
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申请公布号 |
US7160428(B2) |
申请公布日期 |
2007.01.09 |
申请号 |
US20040861059 |
申请日期 |
2004.06.04 |
申请人 |
MITSUI MINING & SMELTING CO., LTD. |
发明人 |
FUJIMOTO AKIRA |
分类号 |
C25D5/02;H01L21/60;C25D5/00;C25D7/06;C25D17/00;C25D21/04;H01L21/48;H01L23/498;H05K1/00;H05K3/24 |
主分类号 |
C25D5/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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