| 摘要 |
A wafer cleaning apparatus is provided to prevent the poor brushing process by supplying a cleaning solution to plural nozzles at uniform pressure and uniformly spraying the cleaning solution onto a wafer. A wafer cleaning apparatus includes a transfer moving a wafer(800) horizontally, plural toggle rollers(560) supporting both sides of the wafer moved by the transfer, upper and lower brushes(520,540) wiping upper and lower surfaces of the wafer, and a manifold(570) having plural nozzles supplied with a cleaning solution and spraying the cleaning solution onto the upper brush. The wafer is lifted above the transfer by the toggle rollers, and is rotated in one direction.
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