| 摘要 |
A device package and a method for manufacturing the same are provided to electrically connect a device with an external circuit by forming a contactor extending from an interior surface of a cap. A device package includes a device substrate(502) having contact pads(508,510) and a device(506), and a cap mounted on the device substrate to define a via having a slightly sloped sidewall. The cap has contactors(302,304) extending from an interior surface of the cap, a contactor pad located on the contactor and contacting the contact pad, a via pad(403) formed on the interior surface of the cap under the via, and a via contact formed on an exterior surface of the cap and in the via. The contactor has a tread, a gasket, and a tread on the gasket.
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