METHODE FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

A method for manufacturing a semiconductor device is provided to restrain the generation of failure in a photoresist coating process and an exposing process and to improve the yield. A photoresist layer is formed on a wafer by using photo spinner equipment(S201). A baking process is performed on the resultant structure(S202). An exposing process is performed on the photoresist layer by using exposure equipment with a predetermined reticle(S203). A developing process is performed on the photoresist layer(S205). Change points of process conditions of the photo spinner equipment and the exposure equipment are checked and an inspection is precisely performed on a first lot after the generation of the change points.