| 摘要 |
A method for manufacturing a substrate for a semiconductor lighting device is provided to reduce complexity of the manufacturing process by not mounting a heat sink through a separate process. A first metal plate is punched, the first metal plate having a first frame, a base(11) formed at a center portion of the first frame, and a support portion connecting the first frame and the base. A second metal plate is punched, the second metal plate having a second frame, joint portions(13) spaced apart from a center portion of the second frame, and external electrodes(15) connecting the second frame with any one of the joint portions. The second frame is aligned with the first frame, and is laid on the first frame. An insulation material is molded to enclose the base and joint portions.
|
