HEAT-RADIATING SHEET AND HAET-RADIATING STRUCTURE

摘要

A heat radiation sheet and a heat radiation structure are provided to radiate heat generated from a heating body of electronic parts included in an electronic device. A heat radiation sheet includes a black lead sheet(22) and an electric insulation elastic layer(23). The black lead sheet(22) is installed on a heating body. The electric insulation elastic layer(23) is installed on a surface of the black lead sheet(22) in opposite to the heating body. The black lead sheet(22) has average thickness below 300 um. The electric insulation elastic layer(23) is formed by an elastic compound which includes a high polymer matrix and a thermal conductive filling material. The electric insulation elastic layer(23) has average thickness in the range of 10 to 280 um. An average diameter of the thermal conductive filling material is below 50% of the average thickness of the electric insulation elastic layer(23). The elastic compound has a thermal conductive filling material above 30 volume%. The elastic compound has a thermal conductive filling material component below 15 volume% in case the average diameter of the thermal conductive filling material is above 95% of the average thickness of the electric insulation elastic layer(23).