| 摘要 |
A bonding apparatus is provided to perform effectively a surface treatment and a bonding process by using micro plasma. A bonding apparatus includes a bonding treatment unit, an inductively coupled micro plasma generating unit, a position changing unit and a control unit. The bonding treatment unit is used for performing a bonding process on a bonding object using a bonding tool. The inductively coupled micro plasma generating unit(34) includes a plasma capillary with an RF(Radio Frequency) coil at a front end portion. The inductively coupled micro plasma generating unit is used for performing a surface treatment on the bonding object. The position changing unit is used for changing a front end position of a wire of the plasma capillary. The control unit is used for controlling a bonding process. |
