| 摘要 |
<p>A circuit substrate is provided to remove a bubble generated in a solder between a pad electrode plane and a land. A circuit substrate includes electronic parts having a pad electrode(22), and a lead terminal(23). The circuit substrate soldering-mounts products sealed by a resin(24). The pad electrode(22) is formed on a bottom plane of the sealed body. The pad electrode(22) has an anchor hole(25) which is penetrated by the resin(24) on a lower plane of an end of the sealed body. The lead terminal(23) is connected to a side of an end of the other side of the sealed body. A front end of the lead terminal(23) is located on a lower part than an electrode plane of the pad electrode(22). The circuit substrate has an aperture which connects an opposite part to the anchor hole(25) of a land on which the pad electrode(22) is mounted to a part on which the pad electrode(22) is not mounted.</p> |
