发明名称 CONDUCTIVE SCILICONE PASTE
摘要 Provided is a conductive silicone paste for blocking the leakage of the electromagnetic interference through the joining part and the connecting part of an electronic device. The conductive silicone paste comprises a conductive filler which comprises 80-140 parts by weight of a conductive metal particle and 1-10 parts by weight of a conductive polymer; and a silicone component which comprises 100 parts by weight of a moisture curing silicone. Preferably the conductive polymer is a carbon particle coated with at least one conductive polymer selected from the group consisting of polyaniline, polypyrrole and polythiophene. Preferably the silicone component comprises further a polyorganosiloxane represented by the formula 1, wherein R1 and R2 are a methyl group, a phenyl group, H, a hydroxyl group, a fluoroalkyl group, a polyoxyalkyl group, a long chained alkyl group or an aminoalkyl group.
申请公布号 KR20070003264(A) 申请公布日期 2007.01.05
申请号 KR20050059090 申请日期 2005.07.01
申请人 ADVANCED MATERIALS & INTEGRATION CO., LTD. 发明人 KIM, SANG CHUL;PARK, JOO YOUN;HWANG, TAE JO;LEE, CHANG HOON;SON, CHANG BOK;SUNG, YONG HO;PARK, KYOUNG HEE;LIM, EUN A;SIN, DONG SOO;OH, KYEONG KEUN
分类号 H01B1/24 主分类号 H01B1/24
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