LIGHT EMITTING DEVICE PACKAGE AND METHOD FOR FABRICATING THE SAME

摘要

A package of a light emitting device and its manufacturing method are provided to reduce the number of components and a thickness of the package by using a filling material of a lens shape. Plural grooves being separated from each other are formed on an upper portion of a sub-mount. A through-hole is formed between the grooves. Electrode lines(410a,410b) are extended to a lower portion of the sub-mount substrate through the through-hole from an inside of the groove. The electrode lines being separated from each other are formed on the respective grooves. Plural light emitting devices(600) are flip-chip-bonded to the electrode line existing in the respective grooves. A filling material(700) encloses the light emitting devices bonded on the respective grooves. The filling material is applied to an upper portion of the sub-mount substrate to be a certain thickness from the upper portion of the sub-mount substrate. Each upper region of the light emitting devices bonded on each groove is processed in a lens shape(710).