FLIP CHIP LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME

摘要

A light emitting device of a flip-chip structure and its manufacturing method are provided to improve light output characteristics by employing a second semiconductor substrate having a light emitting layer. A semiconductor substrate includes a light emitting layer on its surface. A sub-mount substrate is flip-chip-bonded to the first semiconductor substrate to be contacted to a surface of the semiconductor substrate. A second semiconductor substrate includes a light emitting layer on its surface. Other surface of the second semiconductor substrate is bonded to the first semiconductor substrate. The sub-mount substrate includes a P-type bonding pad(55) and an N-type bonding pad(50) that are separated from each other. The P-type bonding pad and the N-type bonding pad are respectively connected to P-type semiconductor layers(13,23) and N-type semiconductor layers(11,21) of the light emitting layer of the first semiconductor substrate.