HEAT SINK FOR POWER MODULE

摘要

A heat sink (1) for a power module can be mounted with a power device (101) at least on one plane. The heat sink (1) is provided with a cooling medium flow path (1d) wherein a cooling medium communicates to dissipate heat from the power device (101), and a corrugated fin (1a) arranged in the cooling medium flow path (1d). The corrugated fin (1a) is provided with ridges (21b) and furrows (21c) extending in a communication direction of the cooling medium, and side walls (21a) connecting the adjacent ridges (21b) and the furrows (21c). A fin section (21) is composed of the two adjacent side walls (21a), and the ridge (21b) or the furrow (21c) positioned between the both side walls (21a). Each side wall (21a) is provided with a louver (31) which at least operates to turn the cooling medium communicating inside a corresponding fin section (21). Heat dissipating performance can be further improved by the heat sink (1).