A heat release package for a light emitting diode is provided to efficiently release heat generated by the light emitting diode by gap-filling a conductor in a plurality of through-holes. A light emitting diode chip(400) is mounted on an upper side of a main frame(200). Plural trough-holes(210) are formed on upward and downward directions of the main frame which is an electric insulator. A conductor is gap-filled in each through hole. An upper conductive layer(220) is formed to cover a part of an upper surface of the main frame. The conductor is gap-filled in a groove formed on the upper surface of the main frame to form the upper conductive layer. A lower conductive layer(230) is formed on a lower surface of the main frame.
