发明名称 Structure having a dielectric layer sandwiched between two conductors for providing enhanced cracking resistance to the dielectric layer
摘要 A structure having a dielectric layer sandwiched between two conductors for providing enhanced cracking resistance to the dielectric layer is disclosed, which comprises a bottom electrode layer, a dielectric layer and a top electrode layer. The structure of the invention is designed with a specific layout that prevents the dielectric layer from cracking while it is formed on a flexible substrate and is subjected to a stress developed by the bending of the substrate. The structure of invention not only can enhance the reliability of an electronic component implementing the structure, but also increase the flexibility of the dielectric layer.
申请公布号 US2007001202(A1) 申请公布日期 2007.01.04
申请号 US20050192179 申请日期 2005.07.29
申请人 INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE 发明人 TSENG HUAI-YUAN;CHEN BO-CHU;LIN CHING-CHIEH
分类号 H01L29/94;H01L27/108;H01L29/76;H01L31/119 主分类号 H01L29/94
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