| 摘要 |
A multi-part lead frame semiconductor device assembly is disclosed including a die bonded to a die paddle. A second lead frame, including leads, is superimposed and bonded onto the first lead frame. Also disclosed is a method for fabricating the multi-part lead frame semiconductor device assembly which utilizes equipment designed for single lead frame processing. If desired, the materials for the multi-part lead frame may be dissimilar.
|
