发明名称 |
CARRIER FOR TEST, BURN-IN, AND FIRST LEVEL PACKAGING |
摘要 |
A plurality of semiconductor devices are provided on a carrier for testing or burning-in. The carrier is then cut up to provide single chip-on-carrier components or multi-chip-on-carrier components. The carrier is used as a first level package for each chip. Thus, the carrier serves a dual purpose for test and burn-in and for packaging. A lead reduction mechanism, such as a built-in self-test engine, can be provided on each chip or on the carrier and is connected to contacts of the carrier for the testing and burn-in steps. The final package after cutting includes at least one known good die and may include an array of chips on the carrier, such as a SIMM or a DIMM. The final package can also be a stack of chips each mounted on a separate carrier. The carriers of the stack are connected to each other through a substrate mounted along a side face of the stack that is electrically connected to a line of pads along an edge of each carrier.
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申请公布号 |
US2007001708(A1) |
申请公布日期 |
2007.01.04 |
申请号 |
US20060531140 |
申请日期 |
2006.09.12 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BERTIN CLAUDE L.;ELLIS WAYNE F.;KELLOGG MARK W.;TONTI WILLIAM R.;ZALESINSKI JERZY M.;LEAS JAMES M.;HOWELL WAYNE J. |
分类号 |
G01R31/26 |
主分类号 |
G01R31/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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