METHOD FOR PRODUCING PRINTED BOARD AND PRINTED BOARD

摘要

A method for mass producing printed boards exhibiting high conductivity at low cost while suppressing pinholes, in which method the printed board can be formed in a pattern of thin lines while reducing environmental load. A photosensitive material for printed boards obtained by such production method, and a photosensitive material satisfying both plating progressiveness and pressure resistance are provided. An emulsion layer provided on a support and containing a silver salt emulsion is exposed and developed to form a metal silver portion and a light transmitting portion. Furthermore, the metal silver portion is subjected to physical phenomenon and/or a plating process thus forming a conductive metal portion where conductive metal particles are supported by the metal silver portion.