EMBEDDING THIN FILM RESISTORS IN SUBSTRATES IN POWER DELIVERY NETWORKS
摘要
<p>Using die side capacitors and embedded resistors, an advantageous power delivery network may be achieved. In some embodiments, the embedded resistors may be more precisely controllable. The number of die side capacitors may be reduced by combining embedded resistors with these capacitors to reduce costs. The embedded resistors may be provided within the metallization layers either at an upperor at a lower level.</p>
申请公布号
WO2007002948(A1)
申请公布日期
2007.01.04
申请号
WO2006US26077
申请日期
2006.06.28
申请人
INTEL CORPORATION;MYAT, MYITZU SOE;CHANG, MOOI;LEE, EU SOON;MIN, YONGKI;LUMPAR, KUALA
发明人
MYAT, MYITZU SOE;CHANG, MOOI;LEE, EU SOON;MIN, YONGKI;LUMPAR, KUALA