| 摘要 |
<p>The invention provides a siloxane resin which exhibits high transparency at a wavelength of 193nm or below and is extremely favorable as the resin component of radiation -sensitive resin compositions useful in the production of LSI's and a radiation- sensitive resin composition useful as a chemically amplified resist which is excellent in depth of focus (DOF) and little suffers development defects. The siloxane resin is one containing in the same molecule structural units (I) represented by the general formula (I) and structural units (II) represented by the general formula (II) wherein the contents of the units (I) and (II) are respectively above 0 mole % but do not exceed 70 mole % [wherein A and B are each a divalent, straight-chain, branched, or cyclic hydrocarbon group; R1 is a monovalent acid- dissociable group; and R2 is straight-chain, branched, or cyclic alkyl]. The radiation-sensitive resin composition comprises (i) a siloxane resin described above and (ii) a radiation -sensitive acid generator. ® KIPO & WIPO 2007</p> |
