发明名称 DIE MODULE SYSTEM AND METHOD
摘要 <p>A flex circuit is populated on one or both sides with plural integrated circuit die. In a preferred mode, the flex circuit is populated with flip-chip die. One side of the flex circuit has a connective facility implemented in a preferred mode with edge connector contacts. The flex circuit is disposed about a substrate to form a circuit module that may be inserted into an edge connector such as ones typically found on a computer board.</p>
申请公布号 WO2007001505(A2) 申请公布日期 2007.01.04
申请号 WO2006US06935 申请日期 2006.02.27
申请人 STAKTEK GROUP L.P.;CADY, JAMES, W.;GOODWIN, PAUL 发明人 CADY, JAMES, W.;GOODWIN, PAUL
分类号 H05K1/14 主分类号 H05K1/14
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