CIRCUIT CONNECTING MATERIAL

摘要

Provided is a circuit connecting material which can be cured rapidly even at a low temperature, is excellent in adhesive strength and adhesion resistance and is used to connect electrically facing circuit electrodes. The circuit connecting material comprises at least two kinds of radical polymerizable compounds; and at least two kinds of radical polymerization initiators. Optionally the circuit connecting material comprises further a thermoplastic resin; a phosphoric acid ester compound; and/or a conductive particle. Preferably at least one of the radical polymerizable compounds is urethane acrylate. Preferably the two radical polymerization initiators are a peroxyester derivative having a molecular weight of 180-1,000.