A semiconductor package system is provided including forming a support platform, mounting a first device over the support platform, forming a bump on the support platform, and mounting a second device on the first device and the bump.
申请公布号
US2007001296(A1)
申请公布日期
2007.01.04
申请号
US20060469307
申请日期
2006.08.31
申请人
STATS CHIPPAC LTD.
发明人
LEE HUN TEAK;KIM JONG KOOK;KIM CHULSIK;JANG KI YOUN;KANG KEON TEAK;JEON HYUNG JUN
