发明名称 SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
摘要 <p>There is provided a semiconductor device including bit lines (14) formed in a semiconductor substrate (10), an insulation film line (18) continuously arranged on the bit lines (14) in the longitudinal direction of the bit line (14), a gate electrode (16) arranged between bit lines (14) on the semiconductor substrate (10), a word line (20) arranged on the gate electrode (16) and extending in the width direction of the bit lines (14), and a trench portion (22) formed between the bit lines (14) and the word lines (20) on the semiconductor substrate. A method for fabricating the semiconductor device is also disclosed. It is possible to provide a semiconductor device and a fabrication method thereof capable of separating elements between the word lines (14) and making a fine memory cell.</p>
申请公布号 WO2007000808(A1) 申请公布日期 2007.01.04
申请号 WO2005JP11814 申请日期 2005.06.28
申请人 SPANSION LLC;SPANSION JAPAN LIMITED;HOSAKA, MASAYA 发明人 HOSAKA, MASAYA
分类号 H01L21/8247;H01L27/115;H01L29/788;H01L29/792 主分类号 H01L21/8247
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