| 摘要 |
A device includes a device substrate defining a pit in a topside of the device substrate, a film bulk-wave acoustic resonator (FBAR) mounted over the pit on the device substrate, a first contact pad on a backside of the device substrate that is coupled to a bottom electrode of the FBAR, and a second contact pad on the backside of the device substrate that is coupled to a top electrode of the FBAR.
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