| 摘要 |
<p>A system (10,11) for solder processing includes a heating zone (14) at a first pressure; a cooling zone (16) at a second pressure higher than the first pressure, the heating and cooling zones in communication with each other and adapted for receiving a component to be soldered; and an outlet (22) in communication with the heating zone for exhausting atmosphere from the heating zone and enabling a flow of gas (34) from the cooling zone to the heating zone.</p> |
