发明名称 METHOD OF DEPOSTING GERMANIUM FILMS
摘要 <p>A chemical vapor deposition method provides a smooth continuous germanium film layer, which is deposited on a metallic substrate at a sufficiently lower temperature to provide a germanium device suitable for use with temperature sensitive materials such as aluminum and copper. Another chemical vapor deposition method provides a smooth continuous silicon germanium film layer, which is deposited on a silicon dioxide substrate at a sufficiently low temperature to provide a germanium device suitable for use with temperature sensitive materials such as aluminum, copper and chalcogenides memory materials.</p>
申请公布号 WO2007002569(A1) 申请公布日期 2007.01.04
申请号 WO2006US24768 申请日期 2006.06.22
申请人 SANDISK 3D LLC;HERNER, S., BRAD 发明人 HERNER, S., BRAD
分类号 C23C16/22;C23C30/00 主分类号 C23C16/22
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