Maskenfilm, Verfahren zu dessen Herstellung, und Verfahren zur Herstellung einer Leiterplatte unter Verwendung desselben

摘要

The manufacturing method of circuit board of the invention includes the steps of (a) forming a mask film (10), in which the mask film comprises a base material (1), a parting layer (2) and a non-parting portion (3) placed on the base material (1), (b) adhering the mask film (10a,10b) to both sides of a prepreg sheet (21), in which the parting layer (2) and non-parting portion (3) are adhered to the prepreg sheet (21), (c) forming a penetration hole (23) in specified positions of the prepreg sheet (21) having the mask film (10a,10b), (d) filling the penetration holes (23) with conductive paste (24) from the mask film side, using the mask film (10a,10b) as the mask, (e) parting the mask film (10a,10b) from the prepreg sheet (21), (f) overlaying metal foils (25a,25b) on both sides of the prepreg sheet (21), (g) heating and pressing the prepreg sheet (21) having the metal foils (25a,25b), and adhering the prepreg sheet (21) and metal foils (25a,25b) mutually, so that the metal foils (25a,25b) placed at both sides are connected electrically with each other through the conductive paste (24) filling up the penetration hole, and (h) etching the metal foils (25a,25b) selectively to form circuit patterns (26a,26b).