Semiconductor stack for use as data processing optical semiconductor component, has semiconductor components stacked on each other with laminar wiring structure on coplanar surface in active upper side of semiconductor chip

摘要

The stack has semiconductor components (5) stacked on top of each other with a laminar wiring structure (6) on a coplanar surface on an upper side of a plastic compound and on an active upper side of a semiconductor chip (4). The structure has component conductor paths (11) extending from contact areas of the active side until their freely lying ends (13) are provided on individual stack edges (14). A stack lower surface has a stack wiring structure (16) with external contact surfaces (17) that are arranged on the ends and/or in electrical connection with the ends by stack conductor paths. Independent claims are also included for: (a) a first method for manufacturing a semiconductor stack with a semiconductor chip (b) a second method for manufacturing a semiconductor stack with a semiconductor chip.