发明名称 Apparatus having reduced warpage in an over-molded IC package
摘要 A dummy circuit pattern is disclosed on a surface of a substrate for a semiconductor package, the dummy circuit pattern including straight line segments having a length controlled so as not to generate stresses within the line segments above a desired stress. The dummy circuit pattern may be formed of lines, or contiguous or spaced polygons, such as hexagons. Portions of the dummy circuit pattern may also be formed with an orientation, size and position that are randomly selected.
申请公布号 US2007001285(A1) 申请公布日期 2007.01.04
申请号 US20050170883 申请日期 2005.06.30
申请人 发明人 TAKIAR HEM;BHAGATH SHRIKAR;WANG KEN J.M.
分类号 H01L23/12 主分类号 H01L23/12
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