| 摘要 |
A circuit substrate on which bubbles generated between a pad electrode and a land can be eliminated is disclosed. Resists are provided at any one of ends of a land on a circuit substrate. Solder paste is printed on the land, and an electronic component (MOSFET or the like) is placed and heated on the same. When the solder paste is melted, an electrode of the electronic component comes into contact with the resists on the circuit substrate. A gap is created by the resists between the land and the electrode of the electronic component. Since the melted solder paste does not wet the resists, bubbles generated in the solder escape to the end of the land through the gap.
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