A METHOD TO MANUFACTURE A UNIVERSAL FOOTPRINT FOR A PACKAGE WITH EXPOSED CHIP
摘要
A semiconductor die package is disclosed. It may include a semiconductor die having a first surface and a second surface, and a leadframe structure. A molding material may be formed around at least a portion of the die and at least a portion of the leadframe structure. A solderable layer may be on the exterior surface of the molding material and the first surface of the semiconductor die.
申请公布号
WO2006076101(A3)
申请公布日期
2007.01.04
申请号
WO2005US44445
申请日期
2005.12.07
申请人
FAIRCHILD SEMICONDUCTOR CORPORATION;NOQUIL, JONATHAN A.;TANGPUZ, CONNIE;MANATAD, ROMEL;MARTIN, STEPHEN;JOSHI, RAJEEV;IYER, VENKAT
发明人
NOQUIL, JONATHAN A.;TANGPUZ, CONNIE;MANATAD, ROMEL;MARTIN, STEPHEN;JOSHI, RAJEEV;IYER, VENKAT