| 摘要 |
A method for producing an electronic assembly and an electronic assembly which has been correspondingly produced are specified. In this case, CMOS structures are formed in a semiconductor substrate to form a circuit and, after the CMOS structures have been formed, at least one electrical conductor is introduced, in a low-temperature process into an opening in the semiconductor substrate in such a manner that the electrical conductor is formed between a first side and a second side, which is opposite the first side, of the semiconductor substrate to connect the circuit. The electronic assembly allows a close arrangement of electronics and detectors and is suitable, for example, for a medical apparatus. |
