Semiconductor component for manufacturing switching power supply, has connecting unit with base ball and balls of solder stacked on base ball, where balls of solder have soldering material and electrical connected with contact pin surface

摘要

The component has a connecting unit (7) including a base ball and balls of solder (6) stacked on the base ball to form external contacts. The balls of solder have a soldering material and stay in electrical connection with a contact pin surface (9) of a wiring substrate. The balls of solder have a protective layer (10) that is not moistenable by the soldering material on a surface of the layer (10). A boundary layer (12) is firmly bonded with the material of the balls of solder. The protective layer has an oxide or nitride or sulphide layer of a material of a base ball. An independent claim is also included for a method for manufacturing a set of semiconductor components.