| 摘要 |
<p>A spin coating method is provided to form uniformly a photoresist layer on the entire surface of a wafer by dropping a coating material on a predetermined portion spaced apart from a center axis of the wafer. A coating material(120) is dropped on a predetermined portion spaced apart from a center axis of a wafer(110). The coating material is spread to fill a center portion of the wafer. The wafer is spun in a first rotation speed in order to distribute the coating material on the wafer itself. The wafer is then spun in a second rotation speed in order to form uniformly the coating material on the entire surface of the wafer. The number of dropping points of the coating material is at least four.</p> |
