发明名称 Process for fabricating semiconductor device
摘要 A semiconductor device comprising: a first insulation film 60 formed above a base substrate 10 ; a second insulation film 61 formed on the first insulation film and having different etching characteristics from the first insulation film; and a capacitor 79 including a storage electrode 68 formed on the second insulation film, projected therefrom, the storage electrode being formed, extended downward from side surfaces of the second insulation film. The lower ends of the storage electrodes are formed partially below the etching stopper film, whereby the storage electrodes are fixed by the etching stopper film. Accordingly, the storage electrodes are prevented from peeling off in processing, such as wet etching, etc. The semiconductor device can be fabricated at high yields.
申请公布号 US7157330(B2) 申请公布日期 2007.01.02
申请号 US20050078519 申请日期 2005.03.14
申请人 FUJITSU LIMITED 发明人 TSUBOI OSAMU;TSUTSUMI TOMOHIKO;YOSHIZAWA KAZUTAKA
分类号 H01L21/8242;H01L21/02;H01L21/311;H01L21/768;H01L27/108 主分类号 H01L21/8242
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