发明名称 Leadframe for a multi-chip package and method for manufacturing the same
摘要 A leadframe for multi-chip package (MCP) including a die pad and a plurality of leads. A dielectric layer is formed on the lower surface of the die pad, so that the die pad is etched to form an interconnecting conductor with a bonding region. An insulation layer is formed on the interconnecting conductor and exposes the bonding region, so that a chip or a passive component can be electrically connected to the leads via the interconnecting conductor.
申请公布号 US7157292(B2) 申请公布日期 2007.01.02
申请号 US20050138491 申请日期 2005.05.27
申请人 ADVANCED SEMICONDUCTOR ENGINEERING, INC. 发明人 HUANG YAO-TING
分类号 H01L21/66;H01L21/44;H01L21/48;H01L21/50;H01L23/495;H01L23/538;H01L25/065;H01L25/16 主分类号 H01L21/66
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