发明名称 |
Leadframe for a multi-chip package and method for manufacturing the same |
摘要 |
A leadframe for multi-chip package (MCP) including a die pad and a plurality of leads. A dielectric layer is formed on the lower surface of the die pad, so that the die pad is etched to form an interconnecting conductor with a bonding region. An insulation layer is formed on the interconnecting conductor and exposes the bonding region, so that a chip or a passive component can be electrically connected to the leads via the interconnecting conductor.
|
申请公布号 |
US7157292(B2) |
申请公布日期 |
2007.01.02 |
申请号 |
US20050138491 |
申请日期 |
2005.05.27 |
申请人 |
ADVANCED SEMICONDUCTOR ENGINEERING, INC. |
发明人 |
HUANG YAO-TING |
分类号 |
H01L21/66;H01L21/44;H01L21/48;H01L21/50;H01L23/495;H01L23/538;H01L25/065;H01L25/16 |
主分类号 |
H01L21/66 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|