| 发明名称 |
Method for producing a semiconductor package, with a rerouted electrode formed on a resin projection portion |
| 摘要 |
An insulating layer ( 3 ) having an opening portion ( 3 a) at a position conformable to an electrode pad ( 2 ) is formed. Next, a resin projection portion ( 4 ) is formed on the insulating layer ( 3 ). Thereafter, a resist film is formed which has opening portions made in regions conformable to the opening portion ( 3 a), the resin projection portion ( 4 ) and the region sandwiched therebetween. A Cu plating layer ( 6 ) is formed by electrolytic copper plating, using the resist film as a mask.
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| 申请公布号 |
US7157363(B2) |
申请公布日期 |
2007.01.02 |
| 申请号 |
US20040949386 |
申请日期 |
2004.09.27 |
| 申请人 |
TEXAS INSTRUMENTS JAPAN LIMITED |
发明人 |
SUZUKI TAKANAO;INABA MASATOSHI;OMINATO TADANORI;KAIZU MASAHIRO;KUROSAKA AKIHITO;INABA MASATOSHI;SADAKATA NOBUYUKI;MASUMOTO MUTSUMI;MASUMOTO KENJI |
| 分类号 |
H01L21/44;H01L21/56;H01L23/31;H01L23/485;H01L23/525 |
主分类号 |
H01L21/44 |
| 代理机构 |
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