| 摘要 |
A circuit device 10 comprises conductive patterns 11 , separated by separation grooves 41 , circuit elements 12 , affixed onto conductive patterns 11 , and an insulating resin 13 , covering circuit elements 12 and conductive patterns 11 and filling separation grooves 41 while exposing the rear surfaces of conductive patterns 11 . Constricted parts 19 are formed at side surfaces of separation grooves 41 . At constricted parts 19 , the width of separation grooves 41 is made narrower than at other locations. Thus by making insulating resin 13 adhere closely to constricted parts 19 , the adhesion of insulating resin 13 with conductive patterns 11 is improved. |
