| 摘要 |
A ball grid array type stack package is provided to reduce a total size of a stacked package by minimizing a size of a single package. A plurality of single packages includes exposed upper and lower patterns and are stacked by using ACFs(Anisotropic Conductive Films)(40). A solder ball(50) is attached on the exposed lower pattern of the single package. A semiconductor chip(33) is loaded on a die paddle(32) of a lead frame which is curved to a top part in order to form a perpendicular state between an outside inner-lead and an inside inner-lead. An inner lead(31) is sealed by using a sealant in order to be exposed to upper and lower surfaces including a lateral surface of the single package.
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