发明名称 |
Surface mount package and method for forming multi-chip microsensor device |
摘要 |
A surface mount package for a multi-chip device has a leadframe formed with first and second die pads and readouts from the respective die pads. An environmentally responsive sensor chip is secured to the first die pad and an environmentally isolated chip is secured to the second die pad. The chips are electrically coupled through the lead frame. A body formed with an over molded portion encases the isolated chip and an open molded portion formed with a recess receives the environmentally sensitive chip. An apertured cover is secured in the recess to form a protective covering over the sensor chip and for allowing communication of the sensor chip externally of the package.
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申请公布号 |
US7157312(B2) |
申请公布日期 |
2007.01.02 |
申请号 |
US20050052290 |
申请日期 |
2005.02.08 |
申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
KIM WOOJIN;DANCASTER JOHN;LOGAN JOHN;BRYZEK ANIELA |
分类号 |
H01L23/495;B29C45/00;B29C45/14;B81B7/00;G01L7/08;G01L9/00;G01L19/14 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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