| 发明名称 |
Method and apparatus for forming metal contacts on a substrate |
| 摘要 |
Solder bump pads are formed on a semiconductor substrate by way of a semiconductor template that has been micromachined to receive solder paste material. The solder paste material is then formed into precisely controlled ball shapes and geometries.
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| 申请公布号 |
US7156362(B2) |
申请公布日期 |
2007.01.02 |
| 申请号 |
US20050246515 |
申请日期 |
2005.10.07 |
| 申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
AKRAM SALMAN |
| 分类号 |
B29C33/00;H01L21/60;H01L21/68;H05K3/34 |
主分类号 |
B29C33/00 |
| 代理机构 |
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