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发明名称
低基部面插排整体生长的碳化矽晶圆
摘要
本发明揭示一种高品质碳化矽单晶圆。该晶圆具有至少约3寸(75 mm)之直径及至少一连续平方寸(6.25 cm2)之表面积,对于一4度离轴晶圆而言,该表面积具有小于约500 cm–2之基部面差排体密度。
申请公布号
TW200700596
申请公布日期
2007.01.01
申请号
TW095112542
申请日期
2006.04.07
申请人
克立公司
发明人
亚德恩 保威;马克 布兰迪;维瑞F 兹维科
分类号
C30B29/36(2006.01);C30B29/60(2006.01);H01L21/302(2006.01)
主分类号
C30B29/36(2006.01)
代理机构
代理人
陈长文
主权项
地址
美国
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