| 摘要 |
A wafer chuck for a semiconductor fabricating apparatus is provided to carry out a process of washing particles under a wafer while carrying out a process of fixing the wafer to the wafer chuck, by forming dry washing holes in wafer sucking columns. A wafer chuck includes wafer sucking columns(110) arranged on a circular plate(100) in a matrix pattern, vacuum sucking holes(120) penetrating a center portion of the wafer sucking column and the circular plate, and dry washing holes(130) formed between the wafer sucking columns in a matrix pattern. Nitrogen or compressed air passes through the dry washing holes to eliminate particles remained on a surface of the plate.
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