发明名称 POLISHING COMPOSITION
摘要 A POLISHING COMPOSITION FOR A SUBSTRATE FOR MEMORY HARD DISK, COMPRISING SILICA PARTICLES IN AN AQUEOUS MEDIUM, WHEREIN THE SILICA PARTICLES SATISFY A SPECIFIED RELATIONSHIP BETWEEN AN AVERAGE PARTICLE SIZE OF THE SILICA PARTICLES ON THE NUMBER BASIS AND A STANDARD DEVIATION ON THE NUMBER BASIS, WHEREIN THE AVERAGE PARTICLE SIZE IS OBTAINED BY A DETERMINATION BY TRANSMISSION ELECTRON MICROSCOPE (TEM) OBSERVATION, AND WHEREIN A PARTICLE SIZE AND A CUMULATIVE VOLUME FREQUENCY IN A RANGE OF PARTICLE SIZES OF FROM 60 TO 120 NM SATISFIES A SPECIFIED RELATIONSHIP; A METHOD OF REDUCING MICROWAVINESS OF A SUBSTRATE FOR MEMORY HARD DISK, COMPRISING THE STEP OF POLISHING AN NI-P PLATED SUBSTRATE FOR MEMORY HARD DISK WITH THE POLISHING COMPOSITION. THE METHOD CAN BE SUITABLY USED FOR THE MANUFACTURE OF A SUBSTRATE FOR PRECISION PARTS, SUCH AS A SUBSTRATE FOR MEMORY HARD DISK.(FIG.1)
申请公布号 MY127587(A) 申请公布日期 2006.12.29
申请号 MY2004PI00041 申请日期 2004.01.08
申请人 KAO CORPORATION 发明人 KENICHI SUENAGA;YOSHIAKI OSHIMA;TOSHIYA HAGIHARA
分类号 B24B7/22;C09G1/02;C09K3/14 主分类号 B24B7/22
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