| 摘要 |
An automatic in-line COG(Chip On Glass) bonding apparatus is provided to automate a COG bonding process including a loading process, a bonding process and an unloading process to efficiently bond semiconductor chips onto glass. An automatic in-line COG bonding apparatus includes a loader(3) in which glass is loaded, a main body(5), an unloader(7), a transfer, and a controller. The main body automatically attaches an ACF(Anisotropic Conductive Film) onto the glass transferred from the loader, centers a semiconductor chip, forms the semiconductor chip onto the surface of the glass, aligns the semiconductor chip, performs preliminary bonding and then carries out main bonding. The unloader is composed of a conveyor that unloads the glass on which the semiconductor chip is mounted. The transfer is located between the loader and the main body and between the main body and the unloader and transfers the semiconductor chip. The controller controls the loader, the main body and the unloader. |
