| 摘要 |
A MULTI-CHIP MODULE COMPRISING STRUCTURE COMPOSED IN A MANNER THAT PLURAL BARE CHIPS OR PACKED SEMICONDUCTOR CHIPS (1) ARE MOUNTED ON A CIRCUIT SUBSTRATE(3), AND THE PLURAL SEMICONDUCTOR CHIPS ARE COVERED BY A HEAT RADIATING PLATE(4), WHEREIN ALL THE SPACES AR SURROUNDING OF THE PLURAL SEMICONDUCTOR CHIPS INTERPOSED BETWEEN THE CIRCUIT SUBSTRATE AND THE HEAT RADIATING PLATE ARE FILLED WITH RESIN(5).IN ACCORDANCE WITH FILLING WITH THE RESIN , IF A STRESS IS ADDED TO A CHIP, THE STRESS CAN BE DISTRIBUTED, BECAUSE THE SEMICONDUCTOR CHIPS ARE CONNECTED EACH OTHER VIA THE RESIN, AND GENERATION OF CRACKS IN THE CHIP AND HEAT RADIATING PLATE CAUSED BY STRESS CONCENTRATION CAN BE DECREASED. BECAUSE THE SEMICONDUCTOR CHIPS ARE ADHERED TO THE HEAT RADIATING PLATE BY RESIN, THE ADHESION OF THE CHIPS AND THE HEAT RADIATING PLATE CAN BE PERFORMED READILY EVEN IF SIZES OF THE CHIPS ARE VARIED. FUTHERMORE, IN ACCORDANCE WITH THE PRESENT INVENTION, ADHESION OF ALL THE CHIPS AND THE HEAT RADIATING PLATE CAN BE PERFORMED SIMULTANEOUSLY BY A STEP.(FIG 1) |
