| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a high frequency package which can be stably used in a wider high frequency band and is assembled by aligning a metal base with a dielectric substrate, with no preparation for a dedicated assembly jig. <P>SOLUTION: Protruded electrodes 10a-10d of a metal base 10, comprising the protruded electrodes 10a-10d protruding upward, are inserted near the side surface of an opening 12a of a dielectric board 12. In this state, the dielectric board 12 is bonded to the metal base 10, with a cavity C provided by the opening 12a of the dielectric board 12. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
