| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a piezoelectric oscillator which can attain miniaturization without giving stress to an IC chip. SOLUTION: The method relates a piezoelectric oscillator comprising a quartz vibrator 11, an IC chip 20, and a package 2 which supports the quartz vibrator 11 and the IC chip 20, respectively. An IC chip 110 comprises an analog circuit 111 including at least an oscillation circuit and a temperature compensation circuit, a memory circuit 112 for memorizing an adjustment data, and a logic circuit 113 for writing the adjustment data into the memory circuit 112. The method comprises a step for writing required data into each memory circuit 112 of a plenty of IC chips 110 at a status of an IC chip wafer 101 to which the plenty of IC chips 110 are connected, a step for cutting the logic circuit 113 and taking out an individual piece of the IC chip 20 including the analog circuit 111 and the memory circuit 112 when an IC chip is taken out from the IC chip wafer 101, and a step for mounting the taken-out IC chip 20 on the package 2. COPYRIGHT: (C)2007,JPO&INPIT
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